Teledyne DALSA new Genie Nano-CXP cameras boast high-speed, high resolution

KUALA LUMPUR, May 31 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology has announced its new Genie Nano-CXP series, a CoaXPress line of CMOS area scan cameras.

The cameras redefine performance and feature the latest On-Semiconductor and E2V sensors, offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price.

Perfectly complemented by the half-length Xtium-CXP frame grabber, these series have been designed to work synergistically, minimise CPU usage and improve processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.

The Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection and machine vision.

For more information, contact http://www.teledynedalsa.com.

-- BERNAMA