KUALA LUMPUR, March 14 (Bernama) -- Teledyne Technologies companies, Teledyne DALSA and Teledyne e2v announced their impending combination as Teledyne Imaging at the Vision China Shanghai 2019.
Both companies will showcase their most advanced vision solutions at the three-day event in Shanghai New International Expo Centre, beginning March 20.
Teledyne e2v will highlight the following CMOS image sensors, namely 3D Time of Flight (ToF) BORA™; Snappy™ family; Lince™ 11M; and, Emerald™ family.
Genie™ Nano 5GigE; Genie™ Nano CXP; Linea™ HS; Z-Trak™; Sherlock™ 8; Deep Learning; 4 Segment Lighting; and, BOA Spot™ will be displayed by Teledyne DALSA.
Teledyne Imaging - a group of leading-edge companies aligned under the Teledyne umbrella comprises unrivalled expertise across the spectrum with decades of experience.
Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world.
-- BERNAMA
-- BERNAMA
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