GUARDSQUARE OPENS FIRST APAC OFFICE IN SINGAPORE

 

KUALA LUMPUR, Oct 6 (Bernama) -- Guardsquare, a provider of mobile application security, has opened its first physical office in the Asia-Pacific (APAC) region in Singapore, strengthening its presence in a market where demand for mobile application and API security is growing.

In a statement, Guardsquare said the new office at Suntec Tower 2 will serve as its regional operational and technical centre, with dedicated sales, technical support and solutions engineering teams.

The Belgium-based company said the expansion builds on a customer base of more than 200 organisations across Asia and 50 per cent year-on-year revenue growth in the region.

The office was officially opened on Oct 1 at an event attended by regional partners, customers, government representatives and business leaders, including Guardsquare Chief Executive Officer, Roel Caers and representatives from the Singapore Economic Development Board and Flanders Investment & Trade.

Caers said APAC was at the forefront of the global mobile economy, with organisations increasingly developing sophisticated applications that consumers rely on daily.

“As the market leader in mobile application security, our presence in Singapore ensures regional developers have direct access to the most comprehensive security available, so they can build, release, and defend their mobile apps with confidence,” said Caers.

The expansion comes as Southeast Asia’s digital economy is projected to surpass US$300 billion, while more than 60 per cent of payments in the region are digital, according to data cited by Guardsquare from Google, Temasek and Bain & Company. (US$1 = RM4.08)

Guardsquare said the Singapore team would help organisations, particularly in the banking, fintech and retail sectors, protect applications against tampering, reverse engineering and fraud while addressing evolving regulatory requirements.

The Singapore office brings Guardsquare’s global office network to seven, with the company also hiring for sales, marketing and engineering positions in the city-state.

-- BERNAMA

AM Intelligence Expands NVIDIA Vera Rubin AI Factory Buildout in India and Malaysia

Two further binding orders of ~20,000 NVIDIA GPUs take AMI's committed NVIDIA Vera Rubin capacity to approximately ~29,000 GPUs and close to 100 MW, part of its global development pipeline of ~400 MW


HYDERABAD, India, Oct 6 (Bernama-BUSINESS WIRE) -- AM Intelligence (“AMI”), the AI infrastructure platform set up by Promoters of Greenko, today announced two further firm and binding orders for 20,000 NVIDIA Rubin GPUs, to be deployed as NVIDIAVera Rubin NVL72 rack-scale systems. Building on its first AI factory in Hyderabad, the expansion is designed to give cloud providers, enterprises and AI developers access to large-scale computing capacity closer to where they build and deploy AI.

These orders are in addition to the AMI's inaugural commitment announced on August 25, 2026, for 9,000 NVIDIA Rubin GPUs at its first AI Factory in Hyderabad.

This follow-on capacity totalling ~70 megawatts (MW) will be deployed at Malaysia and India with delivery scheduled for Q2 2027.

Taken together, the three orders bring AMI's committed frontier compute to approximately 29,000 Rubin GPUs and close to 100 MW of capacity, establishing AMI among the earliest and largest committed buyers of Rubin GPUs outside of North America.

AMI plans to bring additional 300 MWs of capacity to market in the next 15 months, involving capital expenditure of more than $20+ billion in addition to the $6 billion already committed for the initial $100 MW.

“Both facilities will be built to the same architecture standard as the Hyderabad AI Factory, integrating the NVIDIA Vera Rubin platform with high-throughput RDMA over Converged Ethernet (RoCE) networking for fast, efficient data movement, alongside advanced storage systems,” said Anil Chalamalasetty, Chairman, AM Intelligence. “Each site is engineered for high rack power density and liquid cooled throughout, allowing the infrastructure to accommodate successive generations of AI silicon within the same physical footprint.”

“AM Intelligence is bringing the next generation of AI factories to India and Malaysia with NVIDIA Vera Rubin,” said Vishal Dhupar, managing director, Asia South, NVIDIA. “By combining accelerated computing with high-performance networking and liquid-cooled infrastructure, AMI is creating the foundation for developers and enterprises to build more ambitious AI.”

AMI’s ~400 MW Global Pipeline

AMI has developed a pipeline of ~400 MW of Compute-as-a-Service capacity across global locations, including India, the United States, Europe and Malaysia. The three orders placed to date represent the first committed tranche within that pipeline, and the balance is under development for delivery in subsequent phases in 2027 and early 2028.

The pipeline advances AMI's stated intention to bring 1 GW of Compute-as-a-Service capacity to global AI workloads, within a broader programme of 5 GW of powered AI data centres across India, the United States and Europe.

AMI, as a strategic builder of long-term assets, will leverage its unique power solutions, capex advantage and access to next-generation AI infrastructure to deliver best-in-class electron-to-token economics by integrating energy infrastructure with the computing capacity required to train and run AI models. This will enable AI training and inference at scale with a collaborative service offering spanning hyperscalers, neo cloud providers, sovereign AI initiatives, frontier labs, AI natives and local developer communities.

About AM Intelligence:

AM Intelligence (AMI) is building a full-stack AI infrastructure ecosystem spanning energy, data-center infrastructure, hardware, and customized AI models. Backed by Greenko's owned renewable generation and storage, AMI is developing gigawatt-scale, liquid-cooled compute capacity designed to serve global hyperscalers, frontier AI labs, enterprises, and India's sovereign AI initiatives while widening chipset access for Indian developers building domestic and global AI solutions.

View source version on businesswire.com:
https://www.businesswire.com/news/home/20261005478911/en/

Contact

Media contact: media@amintelligencegroup.com; Suhasini.Kona@adfactorspr.com;

Source : AM Intelligence

Digital Science appoints Charlesworth as strategic sales partner of Altmetric and Dimensions in China’s scholarly publishing sector

London, UK, Oct.6, 2026 / Agility-AsiaNet/--

Digital Science has appointed Charlesworth as its strategic sales partner of Altmetric and Dimensions in China’s scholarly publishing sector. This collaboration aims to support the growing demand for research data and information across this rapidly developing market.

China’s local publishing industry has grown significantly in scale and maturity, with journal publishers actively strengthening their international position, investing in publishing capability and seeking greater insight into the reach and impact of research.

The partnership brings together Digital Science’s research technology and data solutions with Charlesworth’s extensive knowledge of the Chinese publishing market and established relationships across publishing clusters, publishers and journals.

Dimensions is one of the world’s largest connected research databases, with 430M+ interconnected records – including publications, conference abstracts, grants, patents, clinical trials and more – enabling users to discover and analyze the global research landscape.

Altmetric tracks and analyzes engagement with research as it is shared, mentioned, reviewed and read online, providing insight into the attention surrounding research beyond traditional citations.

Together, the products can support the continued development of Chinese publishers by providing greater access to research information and a broader understanding of the reach and attention generated by published research.

Michael Evans , CEO of Charlesworth, said:

“Chinese scholarly publishing has developed significantly over recent years. We are seeing increasingly ambitious publishers, publishing clusters and journals looking to build their capabilities, strengthen their international presence and better understand their position within the global research landscape.

“Charlesworth has worked with Chinese publishers for many years, giving us a strong understanding of both the market and its changing needs. Altmetric and Dimensions are highly relevant to this next stage of growth, and we are delighted to be working with Digital Science to make these products more accessible to publishers across China.”

Stephen Leicht , CEO of Digital Science said:

“China is an important and rapidly developing part of the global research ecosystem. As its publishing sector continues to grow and mature, access to high-quality research data and insights can play an important role in supporting that development. Charlesworth’s knowledge of the local market and relationships across the publishing community make them an excellent partner for Digital Science in China.”

The agreement builds on Charlesworth’s long-standing work with the Chinese scholarly publishing community and its role in connecting publishing clusters, publishers and journals with international publishing expertise, technology and services.

About Charlesworth

Charlesworth, part of Enago, works with publishers and the wider research community in China and internationally, providing sales, marketing, technology and author services to support the development and internationalisation of scholarly publishing.

About Digital Science

Digital Science is an AI-focused technology company providing innovative solutions to complex challenges faced by researchers, universities, governments, funders, industry and publishers. We work in partnership to advance global research for the benefit of society. Through our brands – Altmetric, Dimensions, Figshare, IFI CLAIMS Patent Services, metaphacts, Overleaf, ReadCube, Symplectic, and Writefull – we believe when we solve problems together, we drive progress for all. Visit digital-science.com and follow Digital Science on Bluesky , on X or on LinkedIn .

Media Contact

David Ellis , Press, PR & Social Manager, Digital Science: d.ellis@digital-science.com 

SOURCE: Digital Science

--BERNAMA 

Technology Innovation Institute Completes Asteroid-Landing Probe for Landmark Emirates Mission to the Asteroid Belt

 

^{H.E. Faisal Al Bannai, Secretary General of the Advanced Technology Research Council (ATRC), and H.E. Belhoul Al Falasi, Chairman of the UAE Space Agency, sign a model of the UAE-built probe developed by the Technology Innovation Institute (TII) for the Emirates Mission to the Asteroid Belt (EMA). The probe was designed, built and tested in the UAE by TII (Photo: TII)} 



In a first-of-its-kind mission, TII’s probe aboard the MBR Explorer will journey past six asteroids in the main belt before landing on 269 Justitia, making it only the seventh asteroid in history to be reached on its surface by a probe

Designed, built and tested in Abu Dhabi, TII’s probe is the mission’s only deployable payload, operating fully autonomously around and on Justitia

Thought to have formed in the distant Kuiper Belt in the outer Solar System, 269 Justitia may preserve clues to how water and organic material were distributed during the formation of the planets

Watch the EMA hero film here


ABU DHABI, United Arab Emirates, Oct 5 (Bernama-BUSINESS WIRE) -- The Technology Innovation Institute (TII) has revealed the UAE-built probe it has developed for the Emirates Mission to the Asteroid Belt (EMA). The probe will soon travel to Colorado, USA, for final integration with the MBR Explorer spacecraft ahead of its planned 2028 launch. In a historic first, TII’s probe will image two planets and seven asteroids — flying past six asteroids in the main belt before culminating in a rendezvous with and landing on the seventh, 269 Justitia. If successful, the landing will make Justitia only the seventh asteroid in history to be reached on the surface by the probe.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261006586478/en/  

Designed, built and tested end-to-end in Abu Dhabi by TII’s Propulsion and Space Research Center, in collaboration with the UAE Space Agency, as well as HEX20, Khalifa University and UAE University’s National Space Science and Technology Center, the TII-built probe is the mission’s only deployable payload. It will separate from MBR Explorer to make contact with Justitia’s surface at the furthest point of the mission and operate fully autonomously in deep space, capturing close-range images and excavating its surface to provide new insights into its composition and physical characteristics. 269 Justitia is thought to have formed in the Kuiper Belt before migrating into the main asteroid belt during the early formation of the Solar System.

H.E. Faisal Al Bannai, Secretary General, Advanced Technology Research Council, the Abu Dhabi Government entity overseeing TII, and Member of the UAE Supreme Space Council, said: “If you want to build serious technological capability, you take on a problem that forces you to push further. For this mission, that means a probe that must make decisions and operate on its own in deep space. And our teams have built that technology here in the UAE. The mission might still be ahead, but we have already expanded what we know how to build. That is how sovereign capability grows. We solve a difficult problem, then set our sights on a bigger one.”

269 Justitia is among the reddest bodies ever observed in the main asteroid belt. Its spectrum more closely resembles objects in the Kuiper Belt beyond Neptune than neighboring asteroids, suggesting it may have formed in the cold outer Solar System, beyond the distance at which methane and methanol freeze, before migrating inward early in the Solar System’s history to its current orbit in the main asteroid belt. Its surface is thought to be covered in complex organic material produced by the irradiation of that ice. Reaching such a body without a decade-long voyage to the Kuiper Belt itself gives the international scientific community access to material that is otherwise far beyond practical reach, and to evidence bearing on how water and volatiles were distributed as the planets formed.

Dr. Najwa Aaraj, Chief Executive Officer, TII, said: “EMA Probe demonstrates what becomes possible when advanced research is translated into mission-ready engineering. Our teams at TII have developed a system designed to withstand extreme conditions, operate with exceptional precision, and deliver meaningful science billions of kilometers from Earth. The mission reflects not only the caliber of our talent, but the depth of scientific and engineering capability the UAE has built to contribute to some of the world’s most ambitious space missions.”

The MBR Explorer spacecraft will travel approximately 5 billion kilometers over eight years, using gravity-assist maneuvers at Venus, Earth and Mars, and conducting close encounters with six asteroids before arriving at 269 Justitia. The spacecraft is scheduled to launch from Japan in March 2028 within a narrow three-week launch window aligned to interplanetary conditions. Because the spacecraft itself cannot safely approach within a few kilometers of the surface, the probe will separate, make contact with the surface, and deliver the mission’s closest observations.

Dr. Elias Tsoutsanis, Chief Researcher, Propulsion and Space Research Center, TII, said: “The engineering challenge is not simply reaching Justitia, but ensuring the probe can survive an eight-year journey and still perform precisely when it matters most. Every element – from the hardware and thermal design to the onboard software – has been engineered and tested for that final encounter.”

The probe operates fully autonomously throughout its mission, receiving no command from Earth or the MBR Explorer spacecraft after launch. Its onboard software determines when to image, how many images to capture, and which are worth keeping, a capability that rests on the digital processing unit designed and developed by TII – the board that handles the probe’s processing, image selection and power management. The probe does not wait until reaching Justitia to begin; it images throughout the cruise alongside the spacecraft’s other payloads, transmitting data back at approximately six-month intervals. Two cameras, one wide-field and one narrow-field, cover both context and high-resolution data.

Dr. Anton Ivanov, Principal Investigator and Executive Director, Propulsion and Space Research Center, TII, said: “What makes this probe distinctive is the level of independence engineered into such a compact system. Once deployed, it must sense, decide and operate on its own, far beyond Earth. The program has also helped train Emirati engineers and strengthen the advanced capabilities needed to build a globally competitive space technology ecosystem in the UAE.”

On arrival, the MBR spacecraft will spend approximately seven months in orbit around Justitia, beginning at 250 kilometers and descending through a series of lower orbits. The probe will deploy during a low-altitude pass in early 2036, then descend and make contact with the surface, imaging continuously and transmitting to the spacecraft above. The subsequent images will then allow scientists to study material beneath the surface layer that cannot be characterized from orbit.

EMA is the UAE’s second interplanetary mission and the first in which the spacecraft element has been designed, engineered, assembled and tested within the country. The mission sits within a broader national commitment to the sector. In May 2026, the Supreme Space Council approved a AED 1 billion International Space Cooperation Program intended to connect UAE research institutions with counterparts internationally, localize advanced space technologies, and develop Emirati talent, in support of the National Space Strategy 2031.
For more information, visit www.tii.ae

Source: AETOSWire

View source version on businesswire.com:
https://www.businesswire.com/news/home/20261006586478/en/

Contact

Thushara Mohanan, thushara.mohanan@tii.ae

Source : Technology Innovation Institute

INDUSTRIAL WATER ACTION WORKSHOP TO TACKLE WEST JAVA WATER CHALLENGES

 

KUALA LUMPUR, Oct 5 (Bernama) -- Global Water Intelligence (GWI) and Corporate Water Leaders (CWL) will convene the Industrial Water Action Workshop from Nov 16 to 18 in Jakarta, Indonesia, in partnership with Nike and the Water Resilience Coalition.

The workshop will bring together global industrial brands, financial institutions, local manufacturers, utilities and government to turn industrial water challenges in West Java into investable action. The programme will consist of a full-day action-focused workshop and two site visits.

GWI in a statement said the peer-led workshop will bring together first-hand perspectives on water issues affecting industrial operations and explore practical responses to these challenges, as West Java faces serious water supply and pollution problems.

The platform will turn the strongest opportunities into a practical path forward by identifying what needs to happen next and what further financing, technical support or partnerships may be required.

The Industrial Water Action Workshop is intended to be the first in a potential series of action-focused events hosted by CWL, each anchored in a different priority basin.

GWI said attendance for the workshop is curated by invitation, with places reserved for organisations with an active role in addressing West Java’s water challenges.

Over the last 25 years, GWI has built its business around being a trusted interface between its clients and their markets, providing customers with high-level intelligence to help them make informed strategic decisions for their businesses.

-- BERNAMA

KOSA, MegazoneCloud Highlight Korean AI And Software Firms’ ASEAN Expansion

 

KUALA LUMPUR, Sept 30 (Bernama) -- Korea AI·Software Industry Association (KOSA) and MegazoneCloud jointly operated the "Korea Industrial AX Pavilion" at Tech Week Singapore 2026 from Sept 29 to 30.

Tech Week Singapore is a premier technology event in Singapore, attracting over 30,000 attendees across digital sectors, including cloud computing, data centres, artificial intelligence (AI), and cybersecurity.

As part of the ‘Corporate Partnership for Overseas Expansion Program’ administered by MegazoneCloud and KOSA, the initiative leverages MegazoneCloud's global network and market expertise to support Korean small and medium-sized enterprises (SMEs) in developing international sales channels.

In a statement, KOSA said 10 Korean AI and software companies participated in the joint pavilion to expand into Singapore and the broader ASEAN market.

The initiative showcased Korea's AI technologies and solutions driving AI transformation (AX) across industries, highlighting the competitiveness of the domestic AI ecosystem beyond individual brand promotion.

The participating companies represented three key segments of Korea's AI ecosystem, namely AI Infrastructure Solutions, Enterprise Solutions and Industry-Specific Solutions.

The companies engaged in business exchanges by showcasing and demonstrating their core capabilities, including AI semiconductors, infrastructure, enterprise AI and customised industry solutions.

Business matching sessions were also held to facilitate global expansion, including intensive 1:1 meetings with potential clients such as telecommunications companies, data centre operators, financial institutions and global IT enterprises to explore business opportunities in Singapore and the broader ASEAN market.

Following the event, KOSA and MegazoneCloud plan to provide structured follow-up support and ongoing initiatives to help the companies achieve tangible business results.

-- BERNAMA

ERS ELECTRONIC UNVEILS AUTOMATED PANEL-LEVEL PACKAGING SYSTEM

KUALA LUMPUR, Oct 1 (Bernama) -- ERS electronic, a provider of thermal management solutions for semiconductor manufacturing, has introduced a fully automated panel-level packaging (PLP) system for 310×310 mm substrates, integrating temporary carrier bonding, debonding and detaping on a single platform.

“Our new machine reflects our commitment to solving real manufacturing challenges,” said ERS electronic chief executive officer, Laurent Giai-Miniet in a statement.

He added that integrating three traditionally separate process steps into one automated platform enables customers to streamline production, improve process consistency and achieve higher yield and throughput.

The system operates at 13 panels per hour and eliminates inter-tool transfers across three thermally critical process steps. The first unit has been delivered to a leading semiconductor manufacturer for integration into its panel production line.

Developed and manufactured at ERS electronic’s Advanced Packaging facility in Barbing, Germany, the machine combines the company’s 55 years of thermal management expertise with more than 30 years of in-house machine-building capability, following ERS's 2024 integration of a semiconductor specialist equipment engineering team.

ERS has been an early adopter of panel-level packaging, having shipped its first commercial panel-level tool to Fraunhofer IZM in Berlin in 2018. The 310×310 mm panel format is gaining traction because it offers significantly greater substrate area utilisation compared with 300 mm circular wafers.

According to Yole Group, the panel-level packaging market is projected to grow at a compound annual growth rate of more than 40 per cent over the next five years. Dual-carrier bonding and debonding workflows are also becoming increasingly important for backside processing in 3D IC, high-bandwidth memory (HBM) and 2.5D IC packaging.

In dual-carrier processes, bonding and debonding typically require separate machines positioned at different points on the fab floor. Moving panels between tools adds handling steps and transit time while increasing the risk of substrate damage.

ERS said its integrated platform consolidates all three process steps within one system, allowing panels to move between process modules rather than between machines, reducing handling time and risk without requiring changes to the surrounding fab layout.

-- BERNAMA