NORTH READING, Mass., Dec 13 (Bernama-GLOBE NEWSWIRE) -- Teradyne, Inc. (NYSE:TER), a leading supplier of automation equipment for test and industrial applications and Sigurd Corporation today announced the availability of new RF test services at Sigurd utilizing the Teradyne UltraFLEX test system with the UltraWave24 RF test option. This new capability will enable Sigurd to provide their test services customers with the industry’s leading solution for testing 4G, wireless networking, and IoT devices and bringing them to market quickly.
The UltraFLEX is the semiconductor industry's most widely used solution for testing advanced RF transceivers. The UltraFLEX provides industry-leading accuracy and signal integrity that increases device yield to reduce costs and speed times to market. The unique background results processing architecture of the UltraFLEX also enables the highest throughput and test cell productivity of any test solution available today. In addition, the UltraFLEX platform running IG-XL software has been rated #1 in VLSI's customer satisfaction survey for the last four years and the UltraFLEX is the only test platform that offers test program compatibility across all instrument versions-eliminating the expense and disruption of writing new test programs and re-training engineers in order to use next generation test instruments.
The UltraFLEX is the semiconductor industry's most widely used solution for testing advanced RF transceivers. The UltraFLEX provides industry-leading accuracy and signal integrity that increases device yield to reduce costs and speed times to market. The unique background results processing architecture of the UltraFLEX also enables the highest throughput and test cell productivity of any test solution available today. In addition, the UltraFLEX platform running IG-XL software has been rated #1 in VLSI's customer satisfaction survey for the last four years and the UltraFLEX is the only test platform that offers test program compatibility across all instrument versions-eliminating the expense and disruption of writing new test programs and re-training engineers in order to use next generation test instruments.
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