TOKYO, Nov 29 (Bernama-BUSINESS WIRE) -- Toshiba Memory Corporation, the world leader in memory solutions, has today started sampling Universal Flash Storage (UFS) devices[1] utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, BiCS FLASH™ 3D flash memory. [2] The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems.
The new line-up will be available in four capacities: 32GB, 64GB, 128GB and 256GB. [3] All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5 x 13mm package. The controller performs error correction, wear leveling, logical-to-physical address translation and bad-block management, allowing users to simplify system development.
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