TOKYO, Aug 3 (Bernama-BUSINESS WIRE) -- Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape delivers high-grade separation of IC chips from wafers after the stealth dicing process.
Background
Semiconductors have truly become a familiar and necessary part of daily life. Semiconductors will need to offer increased functionality in order to process and utilize the huge amounts of big data that will be generated with the arrival of the age of IoT. These components are expected to continue to grow thinner and denser. Higher grade cutting and separation (dicing) of IC chips from wafers will be required to meet these needs, and a variety of manufacturing methods are already being proposed.
In conventional manufacturing processes, mechanical methods are used to dice wafers into several IC chips. However, in order to obtain chips with better yields and improved quality, methods in which it is made easier for wafers to be broken into chips (such as using a laser to form a modifying layer inside the wafer) and in which wafers are separated and cut by expanding semiconductor tape applied to wafers in a radial direction are gaining recent attention.
Background
Semiconductors have truly become a familiar and necessary part of daily life. Semiconductors will need to offer increased functionality in order to process and utilize the huge amounts of big data that will be generated with the arrival of the age of IoT. These components are expected to continue to grow thinner and denser. Higher grade cutting and separation (dicing) of IC chips from wafers will be required to meet these needs, and a variety of manufacturing methods are already being proposed.
In conventional manufacturing processes, mechanical methods are used to dice wafers into several IC chips. However, in order to obtain chips with better yields and improved quality, methods in which it is made easier for wafers to be broken into chips (such as using a laser to form a modifying layer inside the wafer) and in which wafers are separated and cut by expanding semiconductor tape applied to wafers in a radial direction are gaining recent attention.
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